RZ/G2L微處理器配備Cortex-A55（1.2GHz）CPU、16位DDR3L/DDR4接口、帶Arm Mali-G31的3D圖形加速引擎以及視頻編解碼器（H.264）。此外，這款微處理器還配備有大量接口，如攝像頭輸入、顯示輸出、USB 2.0和千兆以太網(wǎng)，因此特別適用于入門級工業(yè)人機(jī)界面（HMI）和具有視頻功能的嵌入式設(shè)備等應(yīng)用。

在基于瑞薩RZ/G2L MPU的嵌入式開發(fā)過程中，傳統(tǒng)eMMC燒錄流程效率成為生產(chǎn)瓶頸——單板燒錄耗時約5分30秒，嚴(yán)重制約批量生產(chǎn)效率。針對這一痛點，我們創(chuàng)新性地推出了雙階段混合燒錄方案，巧妙結(jié)合SCIF與Fastboot技術(shù)優(yōu)勢，實現(xiàn)了多設(shè)備并行燒錄，大幅縮短了整體耗時。

雙階段技術(shù)架構(gòu)

01Bootloader燒錄階段

通過SCIF接口批量寫入U-Boot至多塊主板eMMC

支持并行操作，避免單板串行等待

02系統(tǒng)鏡像燒錄階段

配置U-Boot啟用Fastboot over USB功能

PC端Fastboot工具同時操控多塊主板，實現(xiàn)分區(qū)創(chuàng)建、內(nèi)核及文件系統(tǒng)并行寫入

效率對比：提升顯著

詳細(xì)實施方案

一、U-Boot配置

在源碼中啟用Fastboot和USB功能支持，并配置相關(guān)功能。

配置文件路徑為：u-boot/git/configs/smarc-rzg2l_defconfig

關(guān)鍵配置示例

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# Fastboot功能配置
CONFIG_USB_FUNCTION_FASTBOOT=y
CONFIG_FASTBOOT_BUF_ADDR=0x4D000000
CONFIG_FASTBOOT_BUF_SIZE=0x8000000
CONFIG_FASTBOOT_USB_DEV=28
CONFIG_FASTBOOT_FLASH=y
CONFIG_FASTBOOT_FLASH_MMC_DEV=0
CONFIG_CMD_FASTBOOT=y


# USB功能配置
CONFIG_USB=y
CONFIG_USB_XHCI_HCD=y
CONFIG_USB_EHCI_HCD=y
CONFIG_USB_GADGET=y
CONFIG_USB_GADGET_MANUFACTURER="Renesas"
CONFIG_USB_GADGET_VENDOR_NUM=0x18D1
CONFIG_USB_GADGET_PRODUCT_NUM=0x4E23

完成配置和源碼修改后編譯，得到fip_pmic.srec、bl2_bp_pmic.srec，再通過SCIF下載模式使用Flash Writer工具燒錄BL2與FIP至eMMC。

二、Fastboot燒錄流程

設(shè)備端操作

在U-Boot控制臺中執(zhí)行以下命令進(jìn)入Fastboot模式：

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setenv serial#'Renesas1'# 自定義設(shè)備唯一標(biāo)識
saveenv
fastboot usb 27 # 啟動USB Fastboot服務(wù)

PC端操作

1驗證設(shè)備連接

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fastbootdevices

2創(chuàng)建并燒寫MBR分區(qū)表（包含500MB啟動分區(qū)和3.5GB根文件系統(tǒng)分區(qū)）

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fastbootflash mbr part.mbr

3創(chuàng)建啟動分區(qū)鏡像

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ddif=/dev/zero of=boot.img bs=1M count=256
sudomkfs.vfat -v -c -F32boot.img

4掛載并復(fù)制內(nèi)核文件

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sudomount boot.img /mnt
cpkernel /mnt
cpdtb /mnt
sudoumount /mnt

5燒錄分區(qū)并重啟

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fastbootflash0:1boot.img#啟動分區(qū)
fastbootflash0:2core-image-minimal-smarc-rzg2l.ext4 # 根文件系統(tǒng)
fastbootreboot

啟動參數(shù)配置

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setenvbootargs 'rw rootwait earlycon root=/dev/mmcblk0p2'
setenvbootcmd 'mmc dev0; fatload mmc0:10x48080000 Image-smarc-rzg2l.bin;
fatloadmmc0:10x48000000 Image-r9a07g044l2-smarc.dtb; booti0x48080000 -
0x48000000'
saveenv

多設(shè)備并行燒錄實戰(zhàn)

通過設(shè)備唯一ID識別，實現(xiàn)單PC控制多設(shè)備同步燒錄：

設(shè)備端設(shè)置

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setenvserial# 'Device_001' # 設(shè)備唯一標(biāo)識
saveenv
fastbootusb0

PC端并行操作

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# 查看已連接設(shè)備
fastbootdevices


# 終端1操作設(shè)備1
fastboot-s Device_001 flash mbr part.mbr
fastboot-s Device_001 flash0:1boot.img
fastboot-s Device_001 reboot


# 終端2同時操作設(shè)備2
fastboot-s Device_002 flash mbr part.mbr
fastboot-s Device_002 flash0:1boot.img
fastboot-s Device_002 reboot

附：單個板子燒錄成功log

fastboot log

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g2l@g2l-VirtualBox:~$ fastboot devices
Renesas1fastboot
g2l@g2l-VirtualBox:~$ fastboot flash mbr part.mbr
targetreported max download size of134217728bytes
sending'mbr' (0KB)...
OKAY[ 0.007s]
writing'mbr'...
OKAY[ 0.007s]
finished. total time:0.014s
g2l@g2l-VirtualBox:~$ fastboot flash0:1boot.img#啟動分區(qū)
targetreported max download size of134217728bytes
sending'0:1' (85274KB)...
OKAY[ 7.543s]
writing'0:1'...
OKAY[ 4.010s]
finished. total time:11.553s
g2l@g2l-VirtualBox:~$ fastboot flash0:2core-image-minimal-smarc-rzg2l.ext4
targetreported max download size of134217728bytes
Invalidsparse file format at header magic
erasing'0:2'...
OKAY[ 5.145s]
sendingsparse '0:2'1/1(80256KB)...
OKAY[ 7.144s]
writing'0:2'1/1...
OKAY[ 54.646s]
finished. total time:66.935s
g2l@g2l-VirtualBox:~$ fastboot reboot
rebooting...
finished. total time:5.601s
g2l@g2l-VirtualBox:~$

boot log

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=> fastboot usb 0
** Bad device specification mmc mbr_a **
Couldn't find partition mmc mbr_a
** Bad device specification mmc mbr **
Couldn't find partition mmc mbr
** Bad device specification mmc mbr **
Couldn't find partition mmc mbr
Starting download of 512 bytes
downloading of 512 bytes finished
fastboot_mmc_flash_write: updating MBR
........ success
** Bad partition specification mmc 0:1_a **
Couldn't find partition mmc 0:1_a
Starting download of 87320576 bytes
..........................................................................
downloading of 87320576 bytes finished
Flashing Raw Image
........ wrote 87320576 bytes to '0:1'
** Bad partition specification mmc 0:2_a **
Couldn't find partition mmc 0:2_a
Erasing blocks 1026048 to 8388608 due to alignment
........ erased 3769630720 bytes from '0:2'
Starting download of 82182548 bytes
..........................................................................
downloading of 82182548 bytes finished
Flashing sparse image at offset 1026048
Flashing Sparse Image
........ wrote 1184509952 bytes to '0:2'
resetting ...
NOTICE: BL2: v2.9(release):v2.5/rzg2l-1.00-3883-gc314a391c-dirty
NOTICE: BL2: Built : 1418, Sep 192023
NOTICE: BL2: eMMC boot from partition 1
NOTICE: BL2: Load dst=0x1f840 src=(p:1)0x20000(256) len=0x10(1)
NOTICE: BL2: eMMC boot from partition 1
NOTICE: BL2: Load dst=0x1f9a0 src=(p:1)0x20010(256) len=0x28(1)
NOTICE: BL2: eMMC boot from partition 1
NOTICE: BL2: Load dst=0x44000000 src=(p:1)0x20090(256) len=0x6069(49)
NOTICE: BL2: eMMC boot from partition 1
NOTICE: BL2: Load dst=0x1f840 src=(p:1)0x20000(256) len=0x10(1)
NOTICE: BL2: eMMC boot from partition 1
NOTICE: BL2: Load dst=0x1f9a0 src=(p:1)0x20010(256) len=0x28(1)
NOTICE: BL2: Load dst=0x1f9a0 src=(p:1)0x20038(256) len=0x28(1)
NOTICE: BL2: eMMC boot from partition 1
NOTICE: BL2: Load dst=0x50000000 src=(p:1)0x26100(304) len=0xc0120(1538)
NOTICE: BL2: Booting BL31
NOTICE: BL31: v2.9(release):v2.5/rzg2l-1.00-3883-gc314a391c-dirty
NOTICE: BL31: Built : 1418, Sep 192023
U-Boot 2021.10 (Feb 182025 - 1150 +0800)
CPU: Renesas Electronics CPU rev 1.0
Model: smarc-rzg2l
DRAM: 1.9 GiB
WDT: watchdog@0000000012800800
WDT: Started with servicing (60s timeout)
MMC: sd@11c00000: 0, sd@11c10000: 1
Loading Environment from MMC... OK
In: serial@1004b800
Out: serial@1004b800
Err: serial@1004b800
U-boot WDT started!
Net: eth0: ethernet@11c20000
Hit any key to stop autoboot: 0
switch to partitions#0, OK
mmc0(part 0) is current device

方案適用場景

01推薦使用場景

產(chǎn)線混合生產(chǎn)不同硬件版本

系統(tǒng)鏡像需要頻繁迭代的開發(fā)階段

小批量多配置定制化訂單

02不適用場景

無USB調(diào)試接口的主板版本

方案價值

通過SCIF+Fastboot兩階段混合燒錄方案，RZG2L平臺不僅實現(xiàn)了多設(shè)備并行燒錄，還大幅提高了生產(chǎn)和開發(fā)效率。該方案尤其適合小批量定制化生產(chǎn)與快速迭代的開發(fā)階段，為嵌入式系統(tǒng)的量產(chǎn)部署提供了一種高效可行的思路。