針對(duì)一種以方形硅膜片為一次敏感元件、硅梁諧振子為二次敏感元件; 采用電阻熱激勵(lì)、
壓敏電阻拾振的壓力微傳感器, 分析了其工作機(jī)理; 依幅值、相位條件討論了該諧振式微傳感器的閉環(huán)自激系統(tǒng); 建立了微傳感器的溫度場(chǎng)模型和熱應(yīng)力模型, 并進(jìn)行了仿真計(jì)算與分析。
關(guān)鍵詞: 熱激勵(lì); 諧振式傳感器; 壓力傳感器; 硅微結(jié)構(gòu)

Abstract: 　A cco rding to the sensing st ructure of a p ract ical silicon resonant p ressure m icro sen2 so r w ho se p relim inary sensing unit is a square silicon diaph ragm and the final sensing unit is a sili2 con beam resonato r, its operat ing mechanism is analyzed. The thermal resisto r acts as the excited unit, and the p iezo resist ive unit acts as the detecto r, fo r the abovem icro senso r. By using the am2 p litude and phase condit ions, the self2excit ing clo sed loop system is invest igated based on the oper2 at ing mechanism fo r the abovem icro senso r. The temperature p rofilemodel and the thermal st ress model are established fo r the beam resonato r of the m icro senso r. Mo reover, the thermal featureis simulated and analyzed fo r the above m icro senso r.
Key words: 　thermal excitat ion; resonant senso r; silicon m icro st ructure; p ressure senso r